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Sr. Packaging Engineer

Company: Microfabrica
Location: Sherman Oaks
Posted on: January 16, 2022

Job Description:

DescriptionWe are looking for a Sr. Packaging Engineer to drive the development of joining and integration processes, qualifying them and supporting the launch of new products. As part of the new product development team, the Sr. Packaging Engineer will help identify and develop innovative solutions to process and manufacturing challenges in a team-based and fast-paced environment. We are a growing company with significant potential for advancement and professional development.
Responsilbilities

  • Planning and executing experiments for development of new joining and reflow processes.
  • Employing various metrology tools and techniques and reliability tests to understand and improve the performance of the bonding/joining processes.
  • Optimizing bonding processes, FMEA and root cause analysis.
  • Compiling and analyzing data, writing reports, and presenting results to team members and management.
  • Supporting the launch and manufacturing of new products and training manufacturing personnel.
  • Maintaining and improving the established joining processes and equipment and providing support to production and troubleshooting technical issues.
  • Interfacing with vendors of equipment and process materials.
    EducationM.S. or Ph.D. in Materials Science, Mechanical Engineering, Chemistry or related field.
    Required Skills And Experience
    • Minimum 7-10 years of experience with electronic packaging, solder systems and reflow processes in a high- tech industry (MEMS, semiconductor, or PCB).
    • Strong foundation of materials science principles and hands-on experience with reflow ovens and flip-chip bonders.
    • Hands-on experience in setting up and maintaining reflow processes, equipment and metrology methods for the control and monitoring of such processes.
    • Experience with diagnosing issues using failure analysis techniques and equipment, researching, and recommending solutions.
    • Experience with, profilometry, surface and bulk analytical methods relevant to characterization of thin films (e.g. XPS, XRD, EDX).
    • General familiarity with MEMS and semiconductor processes.
    • Strong statistical analysis and data mining capabilities with tools like JMP and Excel.
    • Experience with six sigma methodologies (FMEA, SPC, DOE).
    • Strong and independent problem-solving skills. Experience with diagnosing issues using failure analysis techniques and recommending solutions.
    • Excellent written and verbal communication skills and ability to work as a team player in a fast-paced environment. Good presentation skills.
    • Self-motivated, attention to detail, ability to prepare technical reports by collecting, analyzing, and summarizing information, as well as write technical specifications and procedures.
    • Excellent time management skills.
      Desired Skills
      • Experience with technology transfer from R&D into manufacturing
      • Six sigma or statistical process control trainingby Jobble

Keywords: Microfabrica, Los Angeles , Sr. Packaging Engineer, Engineering , Sherman Oaks, California

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