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Principal Electronics Packaging Engineer

Company: BOEING
Location: Stanton
Posted on: April 10, 2021

Job Description:

Position Overview:Boeing Defense Space Security is seeking Electronic Packaging Design Engineers who are interested in designing future generations of satellite electronics to join the Space Electronics organization based in El Segundo, CA.Position Responsibilities:

  • Develops Company technology development strategies and integrates product specifications into technology strategies.
  • Supports development of technical aspects of critical proposals.
  • Leads development of Company make/buy strategy for electronic products.
  • Develops, designs and conducts research that results in new product offerings or business opportunities.
  • Represents the Company in industry research and development activity related various aspects of electronic products design, manufacture and test.
  • Works independently.This position requires an active U.S. Security Clearance with successful completion of a Single Scope Background Investigation (SSBI) by the federal government within the last 5 years (A U.S. Security Clearance that has been active in the past 24 months is considered active)Basic Qualifications (Required Skills and Experience):
    • 10 or more years' experience with solder fatigue
    • 10 or more years' experience with thermal and structural analysis
    • 10 or more years' experience in a leadership role, leading teams or projects to successful completion(+20 heads)
    • 10 or more years' experience with both Commercial and Defense platforms and customersPreferred Qualifications (Desired Skills/Experience):
      • 25 years of electronics packaging experienceTypical Education & Experience:Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 20 or more years' related work experience or an equivalent combination of technical education and experience (e.g. PhD+15 years' related work experience, Master+18 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.This position offers relocation based on candidate eligibility. Basic relocation is available for internal candidates.Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies

Keywords: BOEING, Los Angeles , Principal Electronics Packaging Engineer, Engineering , Stanton, California

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